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- Transfer tapes
Transfer tapes
The "Transfer Tapes" category includes adhesives consisting of an adhesive mass deposited on a liner, without an intermediate backing or with a very fine structure depending on the version. They are used to create discreet, precise, and homogeneous bonds on applications requiring a thin layer and an excellent finish.
These tapes offer very good bonding quality, a high degree of precision, and excellent application control. They are particularly suitable for technical bonding, finishing, light assembly, or installation on complex substrates, while improving the speed and cleanliness of operations.
Why choose a transfer tape?
A transfer tape is similar to a film adhesive: it does not have a traditional backing, but an adhesive layer protected by a liner. It allows for clean, thin, and effective bonding on various materials, while offering a simpler and more consistent application than liquid glue.
This type of tape is particularly suitable for assembly, fixing, or laying coverings, especially in industry, construction, and technical applications.
A precise and effective bonding solution
Transfer tapes allow for discreet bonding, without significant thickness. They are appreciated for their ease of application and their ability to adhere to many substrates, depending on the type of adhesive used.
Some models offer excellent resistance to high temperatures and can meet demanding constraints, such as the installation of flexible coverings, PVC sheets, or technical elements.
Adhesion, cleanliness, and efficiency
A well-chosen transfer tape ensures a reliable, consistent, and uniform bond. It can replace certain applications of liquid glue while reducing installation times, smudges, and handling.
It helps to improve the quality of bonding, optimise repetitive operations, and achieve a clean, durable, and professional finish.
DERFI support
DERFI offers transfer tapes tailored to the needs of professionals in assembly, construction, and industry.
The DERFI support allows you to choose the most suitable solution according to the materials to be bonded, the expected strength, temperature constraints, and the technical requirements of your application.